Thermal is the bottleneck.
We remove it.

Phase-change cooling that decouples heat dissipation from chip design — so you can optimize for what actually matters: performance and density.

10x tokens/watt No redesign required Drop-in package integration
Explore
The Problem

Datacenters are running out of
thermal headroom

Every generation of AI silicon pushes TDP higher. Air can't keep up. Cold plates hit diminishing returns. The result: chips designed around heat, not performance.

1,000W+
Per-package TDP for leading AI accelerators — and climbing every quarter
40%
Of datacenter power consumed by cooling infrastructure, not compute
$2T+
Global datacenter capex by 2028 — mostly thermal-constrained

Architects are making performance tradeoffs to manage heat — spreading dies, limiting stack height, reducing clock speeds. None of these decisions optimize for tokens per watt. They optimize for survival.

The Solution

What matters is output per joule

We engineer phase-change thermal interfaces that absorb and transport heat at the package level — eliminating the Z-height penalty that forces architects to compromise.

Efficiency =
Tokens
Watt · Second

10x compute efficiency. Zero redesign.

Same silicon. Same package. Same fab process. Just remove the thermal ceiling.

Who It's For

Built for the people
holding the bottleneck

For Foundries

Offer what your competitors can't

Give your customers a thermal path to 2,000W packages without a new process node.

  • New revenue line: Thermal integration as a value-add service on existing advanced packaging lines
  • Customer retention: Be the foundry that says "yes" to TDP requests others must decline
  • No capex: Drop-in material, not a new process step
For Chip Designers

Design for performance, not heat

Stop letting thermal dissipation dictate your floorplan. Stack, pack, and clock as the architecture demands.

  • Unlimited TDP headroom: Push per-package power without throttling or derating
  • Dense 3D stacking: Logic-on-memory without the Z-height thermal penalty
  • Shorter interconnects: Optimize for latency, not thermal spread
For Investors

Infrastructure play with software-like margins

A material science moat applied to the single largest cost driver in AI datacenters.

  • Massive TAM: Every high-TDP package in every datacenter is a customer
  • Timing: AI capex supercycle meets a thermal wall that has no conventional solution
  • Defensible IP: Proprietary phase-change formulations validated across 20+ years of thermal R&D
Why Now

We don't just cool chips.
We push the TDP ceiling.

Most thermal vendors solve yesterday's problem. We enable tomorrow's architecture — giving designers the confidence to specify packages that were previously thermally impossible.

📈

We enable higher TDP, not just manage it

Our phase-change interfaces give architects the thermal headroom to spec 2,000W+ packages — turning a constraint into a design parameter you can push.

🏗️

3D packaging is the next frontier

Chiplets, logic-on-memory, and heterogeneous integration all fail at scale without a thermal solution that scales with density.

⚡

Energy is the new bottleneck

Grid constraints are forcing datacenter operators to demand 5–10x efficiency gains. Higher TDP with better thermal management is the only path.

🔬

Phase-change materials are production-ready

Two decades of R&D has matured into formulations that survive real fab and operating conditions. The timing is finally right.

The Team

30+ years across thermal systems.

One shared conviction:
Heat shouldn't be the design constraint.

PW

Paul West, PhD

Founder & CEO

2-time founder. 11+ years in foundry technology development and high-volume production.

PK

Paul Klemencic

Founder & CDO

Thermal systems specialist with 20+ years across energy and thermal management. Deep expertise in TQM and phase-change systems.

We're building the team
that breaks the thermal wall

We're assembling core engineering and investment partners to bring this to production. If this is your problem — or your portfolio thesis — let's talk.

Systems Performance Architects Thermal / CFD Engineers Two-Phase Cooling Specialists Strategic Investors Foundry / Packaging Partners